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477
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Sankt Florian am Inn, Austria
477
Mechanisms for room temperature direct wafer bonding
Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno et al. · Journal of Applied Physics · 2013 · 178 citations
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations
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