A. Farcy

Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia

T. Skotnicki, C. Fenouillet-Béranger, C. Gallon et al. · IEEE Transactions on Electron Devices · 2008 · 210 citations

Engineering, Computer Engineering, Electrical Engineering +17

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

S. Crémer, Nathalie Vulliet, Thierry Pinguet et al. · 2013 · 95 citations

Engineering, Electrical Engineering, Optoelectronics +16

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16