A. Farcy

Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia

T. Skotnicki, C. Fenouillet-Béranger, C. Gallon et al. · IEEE Transactions on Electron Devices · 2008 · 209 citations

Product Level, Engineering, Vlsi Design +22

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 118 citations · Full text

Artificial Intelligence, Engineering, Vlsi Design +26

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

S. Crémer, Nathalie Vulliet, Thierry Pinguet et al. · 2013 · 94 citations

Photonics, Soi Wafers, Optical Interconnects +15

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24