Concepedia

J. Jourdon

JJ

6

Publications

214

Citations

6

H-Index

2018

Active since

Affiliations

STMicroelectronics (France)(Current)

Laboratoire d'Électronique des Technologies de l'Information

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Institut Polytechnique de Bordeaux

J. Jourdon is an author at STMicroelectronics (France) specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectrical EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceMicrofabricationAdvanced PackagingMaterials Engineering3D Printing

Publications per year

2018–2022

6

Publications

6

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements

S. Moreau, J. Jourdon, S. Lhostis et al. · ECS Journal of Solid State Science and Technology · 2022 · 46 citations

Engineering, Reliability Achievements, Interconnect (Integrated Circuits) +16

Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement

J. Jourdon, S. Lhostis, S. Moreau et al. · IEEE Transactions on Electron Devices · 2019 · 32 citations

Engineering, Integrated Circuits, Contact Resistance +19

Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle

Imed Jani, Didier Lattard, Pascal Vivet et al. · 2019 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability

L. Arnaud, S. Moreau, A. Jouve et al. · 2018 · 19 citations

Engineering, Mechanical Engineering, Fine Pitch 3D +17

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