L. Arnaud

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Publications

Citations

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Active since

1988

Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives(Current)

CEA Grenoble

STMicroelectronics (France)

Laboratoire d'Électronique des Technologies de l'Information

Université Grenoble Alpes

L. Arnaud is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, interconnect technology, and electronic materials.

Publications per year

1988–2022

Publications

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Thomas Frank, S. Moreau, C. Chappaz et al. · Microelectronics Reliability · 2012 · 118 citations

Engineering, Electrical Engineering, Materials Science +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects

L. Arnaud, T. Berger, G. Reimbold · Journal of Applied Physics · 2002 · 79 citations

Engineering, Electrical Engineering, Materials Science +13

Resistance increase due to electromigration induced depletion under TSV

Thomas Frank, C. Chappaz, Philip R. LeDuc et al. · 2011 · 73 citations

Natural Sciences, Electrical Engineering, Physics +15

Extensive analysis of resistance evolution due to electromigration induced degradation

Laurent Doyen, E. Petitprez, P. Waltz et al. · Journal of Applied Physics · 2008 · 67 citations

Engineering, Electrical Engineering, Materials Science +12

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