C. Chappaz

Statistics

Publications

Citations

372

H-Index

Active since

2009

Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives(Current)

Laboratoire d'Électronique des Technologies de l'Information

CEA Grenoble

STMicroelectronics (France)

Institut polytechnique de Grenoble

C. Chappaz is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in materials science, electronic materials, and engineering.

Publications per year

2009–2016

Publications

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Thomas Frank, S. Moreau, C. Chappaz et al. · Microelectronics Reliability · 2012 · 118 citations

Engineering, Electrical Engineering, Materials Science +16

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · Journal of The Electrochemical Society · 2011 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

Resistance increase due to electromigration induced depletion under TSV

Thomas Frank, C. Chappaz, Philip R. LeDuc et al. · 2011 · 73 citations

Natural Sciences, Electrical Engineering, Physics +15

Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration

R. Taïbi, L. Di Cioccio, C. Chappaz et al. · 2011 · 29 citations

Engineering, Electrical Engineering, Materials Science +17

Low voltage actuated plate for haptic applications with PZT thin-film

F. Casset, J.S. Danel, C. Chappaz et al. · 2013 · 24 citations

Engineering, Materials Engineering, Materials Science +17

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