Pierric Gueguen

Statistics

Publications

Citations

559

H-Index

Active since

2008

Affiliations

Laboratoire d'Électronique des Technologies de l'Information(Current)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Institut polytechnique de Grenoble

CEA Grenoble

Université Grenoble Alpes

Pierric Gueguen is an author at Laboratoire d'Électronique des Technologies de l'Information specializing in bonding, wafer bonding, and materials science.

Publications per year

2008–2015

Publications

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · Journal of The Electrochemical Society · 2011 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

Copper Direct-Bonding Characterization and Its Interests for 3D Integration

Pierric Gueguen, L. Di Cioccio, Patrice Gergaud et al. · Journal of The Electrochemical Society · 2009 · 67 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

Pierric Gueguen, Caroline Ventosa, L. Di Cioccio et al. · Microelectronic Engineering · 2009 · 52 citations

Engineering, Materials Engineering, Materials Science +13

Enabling technologies for 3D chip stacking

Patrick Leduc, L. Di Cioccio, Barbara Charlet et al. · 2008 · 48 citations

Engineering, Electrical Engineering, Microelectronics +16

Full characterization of Cu/Cu direct bonding for 3D integration

R. Taïbi, L. Di Cioccio, Cédrick Chappaz et al. · 2010 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +15

1–5 of 17