Pierric Gueguen

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · Journal of The Electrochemical Society · 2011 · 84 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +18

Copper Direct-Bonding Characterization and Its Interests for 3D Integration

Pierric Gueguen, L. Di Cioccio, Patrice Gergaud et al. · Journal of The Electrochemical Society · 2009 · 67 citations · Full text

Engineering, Copper Oxide, Interconnect (Integrated Circuits) +17

Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

Pierric Gueguen, Caroline Ventosa, L. Di Cioccio et al. · Microelectronic Engineering · 2009 · 52 citations

Materials Science, 3D Ic Architecture, Engineering +14

Enabling technologies for 3D chip stacking

Patrick Leduc, L. Di Cioccio, Barbara Charlet et al. · 2008 · 47 citations

Engineering, Computer Architecture, Interconnect (Integrated Circuits) +20

Full characterization of Cu/Cu direct bonding for 3D integration

R. Taïbi, L. Di Cioccio, Cédrick Chappaz et al. · 2010 · 45 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17