Statistics
Publications
10
Citations
315
H-Index
10
Active since
2008
Cédrick Chappaz is an author at STMicroelectronics (France) specializing in materials science, engineering, and materials engineering.
Publications per year
2008–2020
10
10
Full characterization of Cu/Cu direct bonding for 3D integration
R. Taïbi, L. Di Cioccio, Cédrick Chappaz et al. · 2010 · 45 citations
Natural Sciences, Materials Engineering, Materials Science +15
Electromigration behavior of 3D-IC TSV interconnects
Thomas Frank, S. Moreau, Cédrick Chappaz et al. · 2012 · 41 citations
Engineering, Electrical Engineering, Electronic Materials +16
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