S. Moreau

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Publications

Citations

1.2K

H-Index

Active since

1999

Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives(Current)

CEA Grenoble

Laboratoire d'Électronique des Technologies de l'Information

STMicroelectronics (France)

Université Grenoble Alpes

S. Moreau is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in electrical engineering, engineering, and electronic packaging.

ORCID

Top concepts

EngineeringElectrical EngineeringElectronic PackagingMicroelectronicsApplied PhysicsMaterial ScienceElectrical Insulation3D IntegrationMicrofabricationMedicine

Publications per year

1999–2023

Publications

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Thomas Frank, S. Moreau, C. Chappaz et al. · Microelectronics Reliability · 2012 · 110 citations

Electrical Engineering, Electromigration Technique, Engineering +12

[Intracranial complications of acute mastoiditis].

E. Babin, F. Brenac, A Béquignon et al. · PubMed · 2001 · 107 citations

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Resistance increase due to electromigration induced depletion under TSV

Thomas Frank, C. Chappaz, Philip R. LeDuc et al. · 2011 · 73 citations

Electrical Engineering, Electromigration Technique, Engineering +10

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