E. Deloffre

FDSOI devices with thin BOX and ground plane integration for 32nm node and below

C. Fenouillet-Béranger, S. Denorme, P. Perreau et al. · Solid-State Electronics · 2009 · 133 citations

Engineering, Computer Engineering, Electrical Engineering +11

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

FDSOI devices with thin BOX and ground plane integration for 32nm node and below

C. Fenouillet-Béranger, S. Denorme, P. Perreau et al. · 2008 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +11

Electrical properties in low temperature range (5K–300K) of Tantalum Oxide dielectric MIM capacitors

E. Deloffre, L. Montès, G. Ghibaudo et al. · Microelectronics Reliability · 2005 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +16