FDSOI devices with thin BOX and ground plane integration for 32nm node and below

C. Fenouillet-Béranger, S. Denorme, P. Perreau, +25

Solid-State Electronics

3D Ic ArchitectureElectrical EngineeringEngineeringVlsi DesignThin Box +10

Efficient multi-V<inf>T</inf> FDSOI technology with UTBOX for low power circuit design

C. Fenouillet-Béranger, Olivier Thomas, P. Perreau, +24

Low-power ElectronicsElectrical EngineeringEngineeringVlsi DesignVlsi Architecture +10

Impact of a 10nm ultra-thin BOX (UTBOX) and ground plane on FDSOI devices for 32nm node and below

C. Fenouillet-Béranger, P. Perreau, S. Denorme, +29

Solid-State Electronics

Electrical EngineeringSemiconductor DeviceEngineeringUltra-thin BoxAdvanced Packaging (Semiconductors) +10

Fully-depleted SOI technology using high-k and single-metal gate for 32 nm node LSTP applications featuring 0.179 μm² 6T-SRAM bitcell

C. Fenouillet-Béranger, J. Todeschini, Jean-Christophe Le-Denmat, +57

Pmos TransistorsSemiconductor TechnologyElectrical EngineeringEngineeringNanoelectronics +11

28nm advanced CMOS resistive RAM solution as embedded non-volatile memory

Antoine Benoist, S. Blonkowski, S. Jeannot, +10

Hybrid FDSOI/bulk High-k/metal gate platform for low power (LP) multimedia technology

C. Fenouillet-Béranger, P. Perreau, Loan Pham-Nguyen, +41

EngineeringVlsi DesignElectronic DesignIntegrated CircuitsSemiconductor Device +15

FDSOI devices with thin BOX and ground plane integration for 32nm node and below

C. Fenouillet-Béranger, S. Denorme, P. Perreau, +25

EngineeringVlsi DesignThin BoxDevice IntegrationFdsoi Devices +18

Endurance/Retention Trade Off in HfOx and TaOx Based RRAM

M. Azzaz, Elisa Vianello, B. Sklénard, +14

EngineeringMemory DesignEmerging Memory TechnologyComputer ArchitectureComputer Memory +14

Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below

C. Fenouillet-Béranger, P. Perreau, S. Denorme, +28

EngineeringVlsi DesignFdsoi DevicesIntegrated CircuitsMv Dibl Reduction +18

Thin-film devices for low power applications

S. Monfray, C. Fenouillet-Béranger, G. Bidal, +12

Solid-State Electronics

Low-power ElectronicsElectrical EngineeringEngineeringThin-film FabricationMicrofabrication +6