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FDSOI devices with thin BOX and ground plane integration for 32nm node and below

3D Ic ArchitectureElectrical EngineeringEngineeringVlsi DesignThin BoxDevice IntegrationNanoelectronicsAdvanced Packaging (Semiconductors)Interconnect (Integrated Circuits)Applied PhysicsFdsoi DevicesElectronic PackagingMicroelectronicsGround Plane IntegrationElectromagnetic Compatibility