Publication | Closed Access

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Electrical EngineeringElectromigration TechniqueEngineeringHardware ReliabilityTsv InterconnectsApplied PhysicsThermal CyclingTime-dependent Dielectric BreakdownMetal Level DielectricElectronic PackagingDevice ReliabilityMicroelectronicsInterconnect (Integrated Circuits)Electrical InsulationElectromagnetic Compatibility