Aurélie Thuaire

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Thomas Frank, S. Moreau, C. Chappaz et al. · Microelectronics Reliability · 2012 · 118 citations

Engineering, Electrical Engineering, Materials Science +16

Resistance increase due to electromigration induced depletion under TSV

Thomas Frank, C. Chappaz, Philip R. LeDuc et al. · 2011 · 73 citations

Natural Sciences, Electrical Engineering, Physics +15

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Engineering, Computer Engineering, Electrical Engineering +17

Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Marek Kolmer, Szymon Godlewski, Rafał Zuzak et al. · Applied Surface Science · 2013 · 43 citations · Full text

Engineering, Materials Engineering, Materials Science +15

Electromigration behavior of 3D-IC TSV interconnects

Thomas Frank, S. Moreau, Cédrick Chappaz et al. · 2012 · 41 citations

Engineering, Electrical Engineering, Electronic Materials +16