H. Chaabouni

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Engineering, Computer Engineering, Electrical Engineering +17

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

L. Cadix, Maxime Rousseau, C. Fuchs et al. · 2010 · 23 citations

Engineering, Computer Engineering, Electrical Engineering +17

Monitoring fracture of high-strength steel under tensile and constant loading using acoustic emission analysis

Lotfi Toubal, H. Chaabouni, Philippe Bocher · Engineering Failure Analysis · 2019 · 22 citations

Engineering, Materials Engineering, Materials Science +16

Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

H. Chaabouni, L.L. Chapelon, M. Aimadeddine et al. · Microelectronic Engineering · 2007 · 19 citations

Natural Sciences, Electrical Engineering, Materials Engineering +14

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

L. Cadix, C. Fuchs, Maxime Rousseau et al. · ECS Transactions · 2010 · 12 citations

Engineering, Computer Engineering, Electrical Engineering +17