L.L. Chapelon

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · Journal of The Electrochemical Society · 2011 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Sensor Optimized for Near and Shortwave Infrared

Jonathan S. Steckel, E. Josse, Andras G. Pattantyus‐Abraham et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 52 citations

Natural Sciences, Materials Engineering, Materials Science +17

Full characterization of Cu/Cu direct bonding for 3D integration

R. Taïbi, L. Di Cioccio, Cédrick Chappaz et al. · 2010 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +15

Characterization and integration of a CVD porous SiOCH (k<2.5) with enhanced mechanical properties for 65 nm CMOS interconnects and below

L.L. Chapelon, V. Arnal, M. Broekaart et al. · Microelectronic Engineering · 2004 · 36 citations

Engineering, Materials Engineering, Materials Science +10

Polymer filling of medium density through silicon via for 3D-packaging

P. Chausse, Mohamed Khalil Bouchoucha, David Henry et al. · 2009 · 27 citations

Engineering, Materials Engineering, Materials Science +13