L. Cadix

High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy et al. · 2009 · 62 citations

High Density Tsv, Engineering, Integrated Circuits +17

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Low-power Electronics, 3D Ic Architecture, Electrical Engineering +14

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

L. Cadix, A. Farcy, C. Bermond et al. · 2009 · 43 citations

Engineering, Stacked Dies, Integrated Circuits +18

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs et al. · Microelectronic Engineering · 2009 · 25 citations

High Density, 3D Ic Architecture, Electrical Engineering +13

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

L. Cadix, Maxime Rousseau, C. Fuchs et al. · 2010 · 23 citations