High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy, +3

High Density TsvEngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility +15

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc, +16

Low-power Electronics3D Ic ArchitectureElectrical EngineeringIsolated MosfetEngineering +12

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

L. Cadix, A. Farcy, C. Bermond, +10

EngineeringStacked DiesIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility +16

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs, +10

Microelectronic Engineering

High Density3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)Engineering +11

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

L. Cadix, Maxime Rousseau, C. Fuchs, +12

First integration of Cu TSV using die-to-wafer direct bonding and planarization

Patrick Leduc, M. Assous, L. Di Cioccio, +10

EngineeringPlanarization TechniqueInterconnect (Integrated Circuits)Copper-filled Through-si ViasWafer Scale Processing +16

Development and characterisation of high electrical performances TSV for 3D applications

David Henry, S. Chéramy, Jean Charbonnier, +11

EngineeringBottom WaferWafer Scale ProcessingAdvanced Packaging (Semiconductors)High Voltage Engineering +16

Process and RF modelling of TSV last approach for 3D RF interposer

C. Fuchs, C. Brunet-Manquat, J. Casanueva Diaz, +12

Rf ModellingEngineeringSilicon Resistivity EffectInterconnect (Integrated Circuits)Electromagnetic Compatibility +14

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking

E. Eid, T. Lacrevaz, S. de Rivaz, +7

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics) +15

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

L. Cadix, C. Fuchs, Maxime Rousseau, +10

ECS Transactions

EngineeringVlsi DesignComputer ArchitectureComputer-aided DesignInterconnect (Integrated Circuits) +19