High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy, +3

High Density TsvEngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility +15

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

L. Cadix, A. Farcy, C. Bermond, +10

EngineeringStacked DiesIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility +16

Frequency Effect on Voltage Linearity of $ \hbox{ZrO}_{2}$-Based RF Metal–Insulator–Metal Capacitors

T. Bertaud, S. Blonkowski, C. Bermond, +4

IEEE Electron Device Letters

Materials ScienceElectrical EngineeringDielectricsFrequency EffectWideband Frequency Characterizations +10

Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz

Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo, +4

Applied Physics Letters

Materials ScienceMultiferroicsOptical MaterialsElectrical EngineeringEngineering +12

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs, +10

Microelectronic Engineering

High Density3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)Engineering +11

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

J. Roullard, A. Farcy, S. Capraro, +8

Hardware Security3D Ic ArchitectureElectrical EngineeringLogic ApplicationsEngineering +13

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

L. Cadix, Maxime Rousseau, C. Fuchs, +12

Intercomparison of permittivity measurement techniques for ferroelectric thin layers

Patrick Quéffélec, Vincent Laur, Alexis Chevalier, +11

Journal of Applied Physics

Materials ScienceMaterials EngineeringElectrical EngineeringError AnalysisEngineering +12

Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud, C. Bermond, T. Lacrevaz, +6

Microelectronic Engineering

Materials ScienceHfo2 FilmsEngineeringOxide ElectronicsWideband Frequency +3

Extraction of (R,L,C,G) interconnect parameters in 2D transmission lines using fast and efficient numerical tools

F. Charlet, C. Bermond, Sylvie Putot, +2

Numerical AnalysisEngineeringEfficient ExtractionComputational MechanicsInterconnect (Integrated Circuits) +15