C. Bermond

High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy et al. · 2009 · 62 citations

High Density Tsv, Engineering, Integrated Circuits +17

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

L. Cadix, A. Farcy, C. Bermond et al. · 2009 · 43 citations

Engineering, Stacked Dies, Integrated Circuits +18

Frequency Effect on Voltage Linearity of $ \hbox{ZrO}_{2}$-Based RF Metal–Insulator–Metal Capacitors

T. Bertaud, S. Blonkowski, C. Bermond et al. · IEEE Electron Device Letters · 2010 · 31 citations

Materials Science, Electrical Engineering, Dielectrics +12

Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz

Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo et al. · Applied Physics Letters · 2009 · 26 citations

Materials Science, Multiferroics, Optical Materials +14

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs et al. · Microelectronic Engineering · 2009 · 25 citations

High Density, 3D Ic Architecture, Electrical Engineering +13