T. Lacrevaz

High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy et al. · 2009 · 62 citations

High Density Tsv, Engineering, Integrated Circuits +17

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Low-power Electronics, 3D Ic Architecture, Electrical Engineering +14

Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz

Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo et al. · Applied Physics Letters · 2009 · 26 citations

Materials Science, Multiferroics, Optical Materials +14

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

J. Roullard, A. Farcy, S. Capraro et al. · 2012 · 24 citations

Hardware Security, 3D Ic Architecture, Electrical Engineering +15

Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud, C. Bermond, T. Lacrevaz et al. · Microelectronic Engineering · 2009 · 18 citations

Materials Science, Hfo2 Films, Engineering +5