T. Lacrevaz - Concepedia

Author

T. Lacrevaz

Université Savoie Mont Blanc

Also Known As

Lacrevaz, T., Lacrevaz, Thierry, T. Lacrevaz, Thierry Lacrevaz

142

Publications

449

Citations

H-Index

Concepts

All Affiliations

Université Savoie Mont Blanc Institut de Microélectronique, Electromagnétisme et Photonique STMicroelectronics (France)Centre National de la Recherche Scientifique Commissariat à l'Énergie Atomique et aux Énergies Alternatives

About

T. Lacrevaz is an author at Université Savoie Mont Blanc specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	266
2	Electrical Engineering	9	9	230
3	Applied Physics	8	8	208
4	Computer Engineering	6	6	143
5	Materials Science	2	2	44

T. Lacrevaz

Publications

266

Citations

H-Index

Page 1

	Year	Citations
High frequency characterization and modeling of high density TSV in 3D integrated circuits C. Bermond, L. Cadix, A. Farcy, High Density TsvEngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility	2009	62
Investigation on TSV impact on 65nm CMOS devices and circuits H. Chaabouni, Maxime Rousseau, Philip R. LeDuc, Low-power Electronics3D Ic ArchitectureElectrical EngineeringIsolated MosfetEngineering	2010	54
Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo, Applied Physics Letters Materials ScienceMultiferroicsOptical MaterialsElectrical EngineeringEngineering	2009	26
Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic J. Roullard, A. Farcy, S. Capraro, Hardware Security3D Ic ArchitectureElectrical EngineeringLogic ApplicationsEngineering	2012	24
Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors T. Bertaud, C. Bermond, T. Lacrevaz, Microelectronic Engineering Materials ScienceHfo2 FilmsEngineeringOxide ElectronicsWideband Frequency	2009	18
3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies P. Coudrain, D. Henry, A. Berthelot, EngineeringFace-to-back Integration SchemeIntegrated CircuitsSensor TechnologyImage Sensor	2013	18
Keep on shrinking interconnect size: Is it still the best solution? D. Deschacht, S. de Rivaz, A. Farcy, Electrical EngineeringInterconnect SizeEngineeringVlsi DesignAdvanced Packaging (Semiconductors)	2010	16
Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives T. Lacrevaz, B. Fléchet, A. Farcy, Microelectronic Engineering Electrical EngineeringEngineeringHigh-frequency DeviceWide Band FrequencyApplied Physics	2006	13
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking E. Eid, T. Lacrevaz, S. de Rivaz, EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics)	2009	13
mmW characterization of wafer level passivation for 3D silicon interposer Yann Lamy, O. El Bouayadi, C. Ferrandon, EngineeringSmart InterposerMicrowave TransmissionInterconnect (Integrated Circuits)Mmw Characterization	2013	12

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