Thermal Cycling
Thermal Cycling is a durability testing method that involves repeated exposure of a material or component to alternating high and low temperature extremes in order to evaluate its resistance to thermal stress-induced degradation over time.
3.4K
Publications
136.5K
Citations
11.4K
Authors
2.3K
Institutions
Publications per year
2017–2026
914
Parents
3.4K
1–5 of 3.4K
11.4K
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2.3K
Auburn University
Auburn, United States
27 h-index
275 publications
11.2K citations

Centre National de la Recherche Scientifique
Paris, France
27 h-index
175 publications
5.8K citations

Chinese Academy of Sciences
Beijing, China
26 h-index
215 publications
11.1K citations
Nanyang Technological University
Singapore, Singapore
25 h-index
100 publications
4.1K citations
Forschungszentrum Jülich
Jülich, Germany
25 h-index
121 publications
10.6K citations

Harbin Institute of Technology
Harbin, China
24 h-index
149 publications
5.4K citations
Massachusetts Institute of Technology
Cambridge, United States
23 h-index
61 publications
3.8K citations
Georgia Institute of Technology
Atlanta, United States
22 h-index
141 publications
4.3K citations
1–8 of 2.3K
68 publications · 3.2K citations
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51 publications · 2.8K citations
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47 publications · 1.7K citations
27
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61 publications · 2K citations
27
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41 publications · 3.5K citations
26
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