Thermal Cycling

Thermal Cycling is a durability testing method that involves repeated exposure of a material or component to alternating high and low temperature extremes in order to evaluate its resistance to thermal stress-induced degradation over time.

3.4K

Publications

136.5K

Citations

11.4K

Authors

2.3K

Institutions

Publications per year

2017–2026

914

Authors

11.4K

  1. JC
    Jeffrey C. Suhling

    Auburn University, United States

    37 publications · 1.7K citations

    22

    h-index

  2. PL
    Pradeep Lall

    Auburn University, United States

    44 publications · 1.7K citations

    22

    h-index

  3. RV
    Robert Vaßen

    Forschungszentrum Jülich, Germany

    15 publications · 1.7K citations

    16

    h-index

  4. JP
    J.H.L. Pang

    Nanyang Technological University, Singapore

    21 publications · 994 citations

    16

    h-index

  5. AD
    Abhijit Dasgupta

    University of Maryland, College Park, United States

    17 publications · 520 citations

    14

    h-index

1–5 of 11.4K

Venues

  1. Journal of Applied Physics

    68 publications · 3.2K citations

    31

    h-index

  2. Surface and Coatings Technology

    51 publications · 2.8K citations

    30

    h-index

  3. Journal of Alloys and Compounds

    47 publications · 1.7K citations

    27

    h-index

  4. Journal of Electronic Packaging

    61 publications · 2K citations

    27

    h-index

  5. Journal of the American Ceramic Society

    41 publications · 3.5K citations

    26

    h-index

1–5