Patrick Leduc

Challenges for 3D IC integration: bonding quality and thermal management

Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 94 citations

Engineering, Bonding Quality, Device Integration +21

Fabrication of three-dimensional electrical connections by means of directed actin self-organization

Rémi Galland, Patrick Leduc, Christophe Guérin et al. · Nature Materials · 2013 · 63 citations

Materials Science, Engineering, Soft Robotics +13

Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

Pierric Gueguen, Caroline Ventosa, L. Di Cioccio et al. · Microelectronic Engineering · 2009 · 52 citations

Materials Science, 3D Ic Architecture, Engineering +14

Enabling technologies for 3D chip stacking

Patrick Leduc, L. Di Cioccio, Barbara Charlet et al. · 2008 · 47 citations

Engineering, Computer Architecture, Interconnect (Integrated Circuits) +20

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

L. Cadix, A. Farcy, C. Bermond et al. · 2009 · 43 citations

Engineering, Stacked Dies, Integrated Circuits +18