N. Sillon

Challenges for 3D IC integration: bonding quality and thermal management

Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 94 citations

Engineering, Bonding Quality, Device Integration +21

Through silicon vias technology for CMOS image sensors packaging

David Henry, F. Jacquet, M. Neyret et al. · 2008 · 75 citations

Backside Technology, 3D Ic Architecture, Electrical Engineering +12

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +19

Integrated RF-MEMS switch based on a combination of thermal and electrostatic actuation

Ph. Robert, D. Saias, C. Billard et al. · 2004 · 58 citations

Thermal Actuation, Electrical Engineering, Integrated Rf Microswitch +13

Micromachined mass spectrometer

N. Sillon, R. Baptist · Sensors and Actuators B Chemical · 2002 · 57 citations

Engineering, Mass Spectrometer, Micromachines +9