Concepedia

M. Neyret

MN

5

Publications

149

Citations

5

H-Index

2008

Active since

Affiliations

CEA Grenoble(Current)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Laboratoire d'Électronique des Technologies de l'Information

Université Grenoble Alpes

Institut polytechnique de Grenoble

M. Neyret is an author at CEA Grenoble specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical Engineering3D Printing3D IntegrationComputer EngineeringInstrumentationMicrofabricationIndustrial Design

Publications per year

2008–2010

5

Publications

5

Through silicon vias technology for CMOS image sensors packaging

David Henry, F. Jacquet, M. Neyret et al. · 2008 · 75 citations

Backside Technology, 3D Ic Architecture, Electrical Engineering +12

Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications

Jean Charbonnier, R. Hida, David Henry et al. · 2010 · 29 citations

Engineering, Computer-aided Design, Packaging Technologies +16

3D integration technology for set-top box application

David Henry, S. Chéramy, Jean Charbonnier et al. · 2009 · 17 citations

Top Chip, Engineering, 3D Modeling +20

Development and characterisation of high electrical performances TSV for 3D applications

David Henry, S. Chéramy, Jean Charbonnier et al. · 2009 · 17 citations

Engineering, Bottom Wafer, Wafer Scale Processing +18

3D integration process flow for set-top box application: Description of technology and electrical results

S. Chéramy, Jean Charbonnier, David Henry et al. · 2009 · 11 citations

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