S. Chéramy

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 65 citations

Engineering, Computer Engineering, Computer Systems +17

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Electrical Engineering, Materials Science +17