P. Coudrain

Advances, challenges and opportunities in 3D CMOS sequential integration

P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text

Materials Science, 3D Ic Architecture, Wafer Scale Processing +15

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 118 citations · Full text

Artificial Intelligence, Engineering, Vlsi Design +26

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS

P. Batude, T. Ernst, Julien Arcamone et al. · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 2012 · 107 citations

3-D Sequential Integration, Engineering, Vlsi Design +27

Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics

Gerard Laguna, Montse Vilarrubí, Yina Betancourt et al. · Applied Thermal Engineering · 2018 · 68 citations · Full text