P. Batude

Advances, challenges and opportunities in 3D CMOS sequential integration

P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text

Materials Science, 3D Ic Architecture, Wafer Scale Processing +15

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

Advances in 3D CMOS sequential integration

P. Batude, M. Vinet, A. Pouydebasque et al. · 2009 · 114 citations

Engineering, Vlsi Design, Sequential Cmos Integration +17

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS

P. Batude, T. Ernst, Julien Arcamone et al. · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 2012 · 107 citations

3-D Sequential Integration, Engineering, Vlsi Design +27

First demonstration of a CMOS over CMOS 3D VLSI CoolCube™ integration on 300mm wafers

Laurent Brunet, P. Batude, C. Fenouillet-Béranger et al. · 2016 · 74 citations

Engineering, Vlsi Design, Integrated Circuits +18