A. Pouydebasque

Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia

T. Skotnicki, C. Fenouillet-Béranger, C. Gallon et al. · IEEE Transactions on Electron Devices · 2008 · 209 citations

Product Level, Engineering, Vlsi Design +22

Advances, challenges and opportunities in 3D CMOS sequential integration

P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text

Materials Science, 3D Ic Architecture, Wafer Scale Processing +15

GeOI pMOSFETs Scaled Down to 30-nm Gate Length With Record Off-State Current

Louis Hutin, C. Le Royer, J.-F. Damlencourt et al. · IEEE Electron Device Letters · 2010 · 122 citations

Engineering, Integrated Circuits, Geoi Pmosfets +17

Unexpected mobility degradation for very short devices : A new challenge for CMOS scaling

Antoine Cros, K. Romanjek, Dominique Fleury et al. · 2006 · 120 citations

Cmos Scaling, Engineering, Vlsi Design +21

Advances in 3D CMOS sequential integration

P. Batude, M. Vinet, A. Pouydebasque et al. · 2009 · 114 citations

Engineering, Vlsi Design, Sequential Cmos Integration +17