A. Pouydebasque - Concepedia

Author

A. Pouydebasque

Laboratoire d'Électronique des Technologies de l'Information

Also Known As

A Pouydebasque, A. Pouydebasque, Arnaud Pouydebasque, Halimaoui, A., Pouydebasque, A.

Publications

1.5K

Citations

H-Index

Concepts

All Affiliations

Laboratoire d'Électronique des Technologies de l'Information Commissariat à l'Énergie Atomique et aux Énergies Alternatives CEA Grenoble Institut polytechnique de Grenoble Université Grenoble Alpes

About

A. Pouydebasque is an author at Laboratoire d'Électronique des Technologies de l'Information specializing in microelectronics, engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	29	1.3K
2	Applied Physics	16	24	939
3	Computer Engineering	11	11	771
4	Natural Sciences	1	1	18
5	Chemical Engineering	1	1	12

A. Pouydebasque

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia T. Skotnicki, C. Fenouillet-Béranger, C. Gallon, IEEE Transactions on Electron Devices Product LevelEngineeringVlsi DesignComputer ArchitectureHardware Security	2008	209
Advances, challenges and opportunities in 3D CMOS sequential integration P. Batude, M. Vinet, B. Prévitali, Materials Science3D Ic ArchitectureWafer Scale ProcessingEngineeringVlsi Design	2011	148
GeOI pMOSFETs Scaled Down to 30-nm Gate Length With Record Off-State Current Louis Hutin, C. Le Royer, J.-F. Damlencourt, IEEE Electron Device Letters EngineeringIntegrated CircuitsGeoi Pmosfets30-Nm Gate LengthSemiconductor Device	2010	122
Unexpected mobility degradation for very short devices : A new challenge for CMOS scaling Antoine Cros, K. Romanjek, Dominique Fleury, Cmos ScalingEngineeringVlsi DesignComputer ArchitectureSemiconductor Device	2006	120
Advances in 3D CMOS sequential integration P. Batude, M. Vinet, A. Pouydebasque, EngineeringVlsi DesignSequential Cmos IntegrationSilicon On InsulatorCmos Sequential Integration	2009	114
3D monolithic integration: Technological challenges and electrical results M. Vinet, P. Batude, C. Tabone, Microelectronic Engineering 3D Ic ArchitectureEngineeringAdvanced Packaging (Semiconductors)Device IntegrationTechnological Challenges	2010	65
High performance 70nm gate length germanium-on-insulator pMOSFET with high-k/metal gate K. Romanjek, Louis Hutin, C. Le Royer, Solid-State Electronics Electrical EngineeringEngineeringNanoelectronicsElectronic EngineeringBias Temperature Instability	2009	40
Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200mm wafers A. Pouydebasque, Claudine Bridoux, F. Jacquet, Sensors and Actuators A Physical EngineeringMicrofabricationVarifocal LiquidOptic DesignIntegrated Actuator	2011	34
3D CMOS integration: Introduction of dynamic coupling and application to compact and robust 4T SRAM P. Batude, M.-A. Jaud, Olivier Thomas, EngineeringVlsi DesignEmerging Memory TechnologyComputer ArchitectureIntegrated Circuits	2008	33
3D monolithic integration P. Batude, M. Vinet, A. Pouydebasque, EngineeringDevice IntegrationComputer ArchitectureComputer-aided DesignIntegrated Circuits	2011	32

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