Concepedia

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud, Didier Lattard, Èric Guthmuller, G. Romano, Alain Gueugnot, François Berger, J. Beltritti, T. Mourier,

2019 · 65 citations · 9 references

Abstract

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator.

References

9

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Dong Uk Lee, Kyung Whan Kim, Kwan Weon Kim et al. · 2014 · 247 citations

Engineering, Computer Engineering, Computer Science +11

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Chang-Chi Lee, C.-P Hung, Calvin Cheung et al. · 2016 · 134 citations

Engineering, Computer Engineering, Electrical Engineering +17

Modular Routing Design for Chiplet-Based Systems

Jieming Yin, Zhifeng Lin, Onur Kayıran et al. · 2018 · 117 citations

Engineering, Computer Engineering, Computer Science +17

Cost-effective design of scalable high-performance systems using active and passive interposers

Dylan Stow, Yuan Xie, Taniya Siddiqua et al. · 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) · 2017 · 105 citations

Engineering, Computer Engineering, Computer Systems +17

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Larissa Djomeni, Thierry Mourier, Stéphane Minoret et al. · Microelectronic Engineering · 2013 · 36 citations

Engineering, Materials Engineering, Materials Science +16