Alain Gueugnot

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 65 citations

Engineering, Computer Engineering, Computer Systems +17

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · 2020 · 60 citations

Engineering, Computer Engineering, High-performance Computing +17

A Room Temperature Flip-Chip Technology for High Pixel Count Micro-Displays and Imaging Arrays

F. Marion, Sylvette Bisotto, Frédéric Berger et al. · 2016 · 18 citations

Engineering, Computer Engineering, Electrical Engineering +17

Characterization of unintentional doping in localized epitaxial GaN layers on Si wafers by scanning spreading resistance microscopy

Thomas Kaltsounis, Helge Haas, Matthieu Lafossas et al. · Microelectronic Engineering · 2023 · 15 citations · Full text

Engineering, Materials Engineering, Materials Science +17