F. Marion

A Room Temperature Flip-Chip Technology for High Pixel Count Micro-Displays and Imaging Arrays

F. Marion, Sylvette Bisotto, Frédéric Berger et al. · 2016 · 18 citations

Engineering, Device Integration, Microscopy +22

A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique

Manuel Fendler, Céline Davoine, F. Marion et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 17 citations

Engineering, Mechanical Engineering, Flip Chip Bonding +18

Recent developments of high-complexity HgCdTe focal plane arrays at leti infrared laboratory

G. Destéfanis, A. Astier, J. Baylet et al. · Journal of Electronic Materials · 2003 · 15 citations

Electrical Engineering, Engineering, Physics +9

A 10μm pitch interconnection technology using micro tube insertion into Al-Cu for 3D applications

B. Goubault de Brugière, F. Marion, Manuel Fendler et al. · 2011 · 13 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Ultra fine pitch hybridization of large imaging detectors

Pierre Castelein, J.M. Debono, Manuel Fendler et al. · 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515) · 2005 · 12 citations

Optical Materials, Engineering, High Resolution +22