F. Jacquet

Through silicon vias technology for CMOS image sensors packaging

David Henry, F. Jacquet, M. Neyret et al. · 2008 · 75 citations

Backside Technology, 3D Ic Architecture, Electrical Engineering +12

A one transistor cell on bulk substrate (1T-Bulk) for low-cost and high density eDRAM

R. Ranica, A. Villaret, P. Malinge et al. · 2004 · 39 citations

Bulk Silicon Substrate, High-density Edram, Engineering +18

Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200mm wafers

A. Pouydebasque, Claudine Bridoux, F. Jacquet et al. · Sensors and Actuators A Physical · 2011 · 34 citations

Engineering, Microfabrication, Varifocal Liquid +5

Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

David Henry, Jean Charbonnier, P. Chausse et al. · 2008 · 33 citations

Electrical Resistance, Electrical Results, Engineering +18

An alpha immune and ultra low neutron SER high density SRAM

Ph. Roche, F. Jacquet, C. Caillat et al. · 2004 · 25 citations

Hardware Security, Non-volatile Memory, Electrical Engineering +15