T. Berger

Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects

L. Arnaud, T. Berger, G. Reimbold · Journal of Applied Physics · 2002 · 79 citations

Engineering, Severe Plastic Deformation, Electronic Packaging +17

Microstructure and electromigration in copper damascene lines

Lucile Arnaud, G. Tartavel, T. Berger et al. · Microelectronics Reliability · 2000 · 74 citations

Materials Engineering, Materials Science, Electromigration Technique +5

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Sensor Optimized for Near and Shortwave Infrared

Jonathan S. Steckel, E. Josse, Andras G. Pattantyus‐Abraham et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 47 citations

Optical Materials, Quantum Photonics, Shortwave Infrared +30

Shock deformation of polycrystalline aluminium

M. F. Rose, T. Berger · Philosophical magazine · 1968 · 46 citations

Materials Science, Room Temperature, Point Defects +15

High performance k=2.5 ULK backend solution using an improved TFHM architecture, extendible to the 45nm technology node

Robert Fox, O. Hinsinger, E. Richard et al. · 2006 · 17 citations

Low-power Electronics, Improved Tfhm Architecture, Electrical Engineering +13