Lucile Arnaud

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

Microstructure and electromigration in copper damascene lines

Lucile Arnaud, G. Tartavel, T. Berger et al. · Microelectronics Reliability · 2000 · 74 citations

Engineering, Electrical Engineering, Materials Engineering +10

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · 2020 · 60 citations

Engineering, Computer Engineering, High-performance Computing +17

Electromigration behavior of 3D-IC TSV interconnects

Thomas Frank, S. Moreau, Cédrick Chappaz et al. · 2012 · 41 citations

Engineering, Electrical Engineering, Electronic Materials +16

Reliability approach of high density Through Silicon Via (TSV)

Thomas Frank, Cédrick Chappaz, Patrick Leduc et al. · 2010 · 36 citations

Engineering, Electrical Engineering, Materials Science +17