O. Hinsinger

Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types

Cindy Goldberg, Susan Downey, Vincent Fiori et al. · 2005 · 17 citations

Engineering, Mechanical Engineering, Flip-chip Packages +19

High performance k=2.5 ULK backend solution using an improved TFHM architecture, extendible to the 45nm technology node

Robert Fox, O. Hinsinger, E. Richard et al. · 2006 · 17 citations

Low-power Electronics, Improved Tfhm Architecture, Electrical Engineering +13

Validated 90nm CMOS technology platform with low-k copper interconnects for advanced system-on-chip (SoC)

T. Devoivre, M.M. Lunenborg, C. Julien et al. · 2003 · 16 citations

Engineering, Vlsi Design, Computer Architecture +19

Demonstration of an extendable and industrial 300mm BEOL integration for the 65-mn technology node

O. Hinsinger, Robert Fox, E. Sabouret et al. · 2005 · 15 citations

65-Mn Technology Node, Electrical Engineering, Physical Design (Electronics) +14

Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

R.J.O.M. Hoofman, J. Michelon, P.H.L. Bancken et al. · 2005 · 12 citations

Engineering, Numerous Reliability Issues, Continuous Downscaling +20