R.J.O.M. Hoofman - Concepedia

Author

R.J.O.M. Hoofman

Also Known As

R. Hoofman, R. J. O. M. Hoofman, R.J.O.M. Hoofman, ROMANO J.O.M. HOOFMAN, Romano Hoofman, Romano J. O. M. Hoofman, Romano J.O.M Hoofman, Romano J.O.M. Hoofman

Publications

Citations

H-Index

Concepts

All Affiliations

Philips (Belgium)IMEC Delft University of Technology NXP (Belgium)KU Leuven

About

R.J.O.M. Hoofman is an author at Philips (Belgium) specializing in engineering, applied physics, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	19	799
2	Applied Physics	12	15	720
3	Chemistry	3	3	360
4	Natural Sciences	1	1	43
5	Biomedical Engineering	1	1	29

R.J.O.M. Hoofman

Publications

886

Citations

H-Index

Page 1

	Year	Citations
Highly mobile electrons and holes on isolated chains of the semiconducting polymer poly(phenylene vinylene) R.J.O.M. Hoofman, Matthijs P. de Haas, Laurens D. A. Siebbeles, Nature Materials ScienceConducting PolymerPolymer MaterialEngineeringSemiconducting Polymer	1998	295
Challenges in the implementation of low-k dielectrics in the back-end of line R.J.O.M. Hoofman, G.J.A.M. Verheijden, J. Michelon, Microelectronic Engineering Electrical EngineeringDielectricsEngineeringHigh-frequency DeviceAntenna	2005	110
The Formation and Recombination Kinetics of Positively Charged Poly(phenylene vinylene) Chains in Pulse-Irradiated Dilute Solutions Ferdinand C. Grozema, R.J.O.M. Hoofman, Luis P. Candeias, The Journal of Physical Chemistry A	2003	62
Moisture Influence on Porous Low-<tex>$k$</tex>Reliability J. Michelon, R.J.O.M. Hoofman IEEE Transactions on Device and Materials Reliability DielectricsEngineeringMoisture UptakeNanoporous MaterialMoisture Influence	2006	55
Anisotropy of the charge-carrier mobility in polydiacetylene crystals R.J.O.M. Hoofman, Laurens D. A. Siebbeles, Matthijs P. de Haas, The Journal of Chemical Physics EngineeringChemistryCharge TransportPolymersConducting Polymer	1998	43
Etch and strip induced material modification of porous low-k (k=2.2) dielectric Yuki Furukawa, R.A.M. Wolters, H.H.A.J. Roosen, Microelectronic Engineering Materials EngineeringMaterials SciencePorous Low-kDielectricsEngineering	2004	31
Advanced Cu interconnects using air gaps L.G. Gosset, A. Farcy, J. de Pontcharra, Microelectronic Engineering 3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Nanoelectronics	2005	30
CMOS biosensor platform F. Widdershoven, David Van Steenwinckel, J. Uberfeld, NanosensorsEngineeringBiochemical SensorsDetection PrincipleSensor Interface	2010	29
Void growth modeling upon electromigration stressing in narrow copper lines David Tio Castro, R.J.O.M. Hoofman, J. Michelon, Journal of Applied Physics EngineeringVoid GrowthChemical DepositionInterconnect (Integrated Circuits)Resistance Profiles	2007	24
Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects Zsolt Tökei, V. Sutcliffe, S. Demuynck, EngineeringTddb ReliabilityInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electronic Packaging	2004	22

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