P.H.L. Bancken

Advanced Cu interconnects using air gaps

L.G. Gosset, A. Farcy, J. de Pontcharra et al. · Microelectronic Engineering · 2005 · 30 citations

3D Ic Architecture, Electrical Engineering, Engineering +7

Thermal resistance investigations on new leadframe-based LED packages and boards

B. Pardo, A. Gasse, A. Fargeix et al. · Microelectronics Reliability · 2013 · 30 citations

Materials Science, Electrical Engineering, Solid-state Lighting +10

The evolution of multi-level air gap integration towards 32 nm node interconnects

R. Daamen, P.H.L. Bancken, Việt Hùng Nguyễn et al. · Microelectronic Engineering · 2007 · 22 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

Thermal Analysis of LED Lamps for Optimal Driver Integration

X. Perpiñà, R.J. Werkhoven, J. Jakovenko et al. · IEEE Transactions on Power Electronics · 2014 · 22 citations

Electrical Engineering, Solid-state Lighting, Engineering +14

Low energy boron implantation in silicon and room temperature diffusion

E. J. H. Collart, K. Weemers, N. E. B. Cowern et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 1998 · 19 citations

Boron Nitride, Engineering, Physics +6