R. Daamen - Concepedia

Author

R. Daamen

Philips (Belgium)

Also Known As

R. Daamen, Roel Daamen

Publications

413

Citations

H-Index

Concepts

All Affiliations

Philips (Belgium)NXP (Belgium)NXP (Netherlands)Delft University of Technology CEA Grenoble

About

R. Daamen is an author at Philips (Belgium) specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	332
2	Electrical Engineering	8	8	284
3	Applied Physics	4	4	80
4	Computer Engineering	3	3	172
5	Chemical Engineering	1	1	17

R. Daamen

Publications

376

Citations

H-Index

Page 1

	Year	Citations
A 1.2-V 8.3-nJ CMOS Humidity Sensor for RFID Applications Zhichao Tan, R. Daamen, A. Humbert, IEEE Journal of Solid-State Circuits Electrical EngineeringBiomedical SensorsEnergy HarvestingRfid ApplicationsEngineering	2013	137
Advanced Cu interconnects using air gaps L.G. Gosset, A. Farcy, J. de Pontcharra, Microelectronic Engineering 3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Nanoelectronics	2005	30
A Physical Model for Dishing during Metal CMP Việt Hùng Nguyễn, R. Daamen, H. van Kranenburg, Journal of The Electrochemical Society	2003	30
A 1.8V 11&#x03BC;W CMOS smart humidity sensor for RFID sensing applications Zhichao Tan, R. Daamen, A. Humbert, EngineeringEnergy EfficiencyLow Cost SensorSensor InterfaceRfid Sensing Applications	2011	29
A 1.2V 8.3nJ energy-efficient CMOS humidity sensor for RFID applications Zhichao Tan, Youngcheol Chae, R. Daamen, Low-power ElectronicsEnergy ConsumptionElectrical EngineeringEnergy HarvestingRfid Applications	2012	25
The evolution of multi-level air gap integration towards 32 nm node interconnects R. Daamen, P.H.L. Bancken, Việt Hùng Nguyễn, Microelectronic Engineering 3D Ic ArchitectureElectrical EngineeringEngineeringVlsi DesignDevice Integration	2007	22
Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process Việt Hùng Nguyễn, R. Daamen, R.J.O.M. Hoofman Microelectronic Engineering Materials SciencePad ChoicesEngineeringMaterial ProcessingMechanical Engineering	2004	18
Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach F. Gaillard, J. de Pontcharra, L.G. Gosset, Microelectronic Engineering Materials ScienceChemical EngineeringEngineeringMicrofabricationMaterials Fabrication	2006	17
Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask R. Daamen, P.H.L. Bancken, D. Ernur Badaroglu, Materials ScienceMaterials EngineeringElectrical Engineering3D Ic ArchitectureEngineering	2007	16
Air gap formation by UV-assisted decomposition of CVD material Marianna Pantouvaki, A. Humbert, E. VanBesien, Microelectronic Engineering Materials ScienceSurface ProcessingAir Gap FormationChemical Vapor Deposition	2008	14

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