Concepedia

The evolution of multi-level air gap integration towards 32 nm node interconnects

R. Daamen, P.H.L. Bancken, Việt Hùng Nguyễn, A. Humbert, G.J.A.M. Verheijden, R.J.O.M. Hoofman

Microelectronic Engineering · 2007 · 22 citations · 2 references

DOI

Concepts

References

2

Challenges in the implementation of low-k dielectrics in the back-end of line

R.J.O.M. Hoofman, G.J.A.M. Verheijden, J. Michelon et al. · Microelectronic Engineering · 2005 · 111 citations

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The Effect of Plasma Damage on the Material Composition and Electrical Performance of Different Generations of SiOC(H) Low k Films

A. Humbert, Didem Ernur Badaroglu, R.J.O.M. Hoofman · MRS Proceedings · 2006 · 11 citations

, , +15