Publication | Closed Access
The evolution of multi-level air gap integration towards 32 nm node interconnects
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Citations
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References
2007
Year
3D Ic ArchitectureElectrical EngineeringEngineeringVlsi DesignDevice IntegrationAdvanced Packaging (Semiconductors)NanoelectronicsApplied PhysicsComputer EngineeringElectronic PackagingMicroelectronicsNm Node InterconnectsInterconnect (Integrated Circuits)Electromagnetic Compatibility
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