Vincent Fiori

Method for Managing the Stress Due to the Strained Nitride Capping Layer in MOS Transistors

Stphane Orain, Vincent Fiori, D. Villanueva et al. · IEEE Transactions on Electron Devices · 2007 · 44 citations

Engineering, Transistor Improvement, Cesl Parts +16

A multi scale finite element methodology to evaluate wire bond pad architectures

Vincent Fiori, S. Orain · 2005 · 40 citations

Engineering, Mechanical Engineering, Multiscale Material +20

Mechanical and Electrical Analysis of Strained Liner Effect in 35 nm Fully Depleted Silicon-on-Insulator Devices with Ultra Thin Silicon Channels

C. Gallon, C. Fenouillet-Béranger, S. Denorme et al. · Japanese Journal of Applied Physics · 2006 · 26 citations

3D Multi Scale Modeling of Wire Bonding Induced Peeling in Cu/Low-k Interconnects: Application of an Energy Based Criteria and Correlations with Experiments

Vincent Fiori, Lau Teck Beng, Susan Downey et al. · 2007 · 25 citations

Engineering, Mechanical Engineering, Cu/low-k Interconnects +23

Cu/SiO<inf>2</inf> hybrid bonding: Finite element modeling and experimental characterization

C. Sart, Rafaël Estevez, Vincent Fiori et al. · 2016 6th Electronic System-Integration Technology Conference (ESTC) · 2016 · 25 citations

Engineering, Integrated Circuits, Thermal Annealing +18