Concepedia

Lau Teck Beng

LT

Statistics

Publications

2

Citations

35

H-Index

2

Active since

2007

Affiliations

STMicroelectronics (India)(Current)

Lau Teck Beng is an author at STMicroelectronics (India) specializing in mechanical engineering, applied physics, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringPhotonics3D PrintingLaser DamageLaser Design

Publications per year

2007–2009

2

Publications

2

3D Multi Scale Modeling of Wire Bonding Induced Peeling in Cu/Low-k Interconnects: Application of an Energy Based Criteria and Correlations with Experiments

Vincent Fiori, Lau Teck Beng, Susan Downey et al. · 2007 · 25 citations

Engineering, Mechanical Engineering, Cu/low-k Interconnects +23

Laser grooving characterization for dicing defects reduction and its challenges

Koh Wen Shi, Lau Teck Beng, K. Y. Yow · 2009 · 10 citations

Optical Materials, Engineering, Mechanical Engineering +21

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