Concepedia

Susan Downey

SD

Statistics

Publications

3

Citations

52

H-Index

3

Active since

2002

Affiliations

STMicroelectronics (France)(Current)

Susan Downey is an author at STMicroelectronics (France) specializing in applied physics, electronic packaging, and mechanical engineering.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical EngineeringNanoelectronicsSolid Mechanics

Publications per year

2002–2007

3

Publications

3

3D Multi Scale Modeling of Wire Bonding Induced Peeling in Cu/Low-k Interconnects: Application of an Energy Based Criteria and Correlations with Experiments

Vincent Fiori, Lau Teck Beng, Susan Downey et al. · 2007 · 25 citations

Engineering, Mechanical Engineering, Cu/low-k Interconnects +23

Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types

Cindy Goldberg, Susan Downey, Vincent Fiori et al. · 2005 · 17 citations

Engineering, Mechanical Engineering, Flip-chip Packages +19

Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 μm mixed mode signal and system-on-a-chip (SoC) applications

Ruichen Liu, C. H. Lin, Edward B. Harris et al. · 2002 · 10 citations

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