A. Jouve

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +19

Facilitating Ultrathin Wafer Handling for TSV Processing

A. Jouve, Shelly Fowler, Mark Privett et al. · 2008 · 42 citations

Engineering, Mechanical Engineering, Ultrathin Wafer Handling +17

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +15