Mark Privett - Concepedia

Author

Mark Privett

Also Known As

M. Privett, Mark Privett

Publications

194

Citations

H-Index

Concepts

All Affiliations

Mark Privett is an author at Brewer Science (United States) specializing in electronic packaging, engineering, and microfabrication.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	189
2	Applied Physics	5	5	189
3	Computer Engineering	2	2	106
4	Electrical Engineering	2	2	87
5	Logistics	1	1	61

Mark Privett

Publications

189

Citations

H-Index

Page 1

	Year	Citations
Integration of a temporary carrier in a TSV process flow Jean Charbonnier, S. Chéramy, David Henry, EngineeringMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Logistics	2009	61
Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers Stefan Pargfrieder, Paul Kettner, Mark Privett, EngineeringUltra-thin WafersInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2008	45
Facilitating Ultrathin Wafer Handling for TSV Processing A. Jouve, Shelly Fowler, Mark Privett, EngineeringMechanical EngineeringUltrathin Wafer HandlingInterconnect (Integrated Circuits)Wafer Scale Processing	2008	42
Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications Anne Jourdain, Alain Phommahaxay, Greet Verbinnen, EngineeringStacked Ic TechnologiesWafer Scale ProcessingAdvanced Packaging (Semiconductors)Material Processing	2013	23
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications Anne Jourdain, Thibault Buisson, Alain Phommahaxay, EngineeringMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Temporary Wafer Bonding	2010	18

Page 1