Mark Privett

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +19

Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers

Stefan Pargfrieder, Paul Kettner, Mark Privett et al. · 2008 · 45 citations

Engineering, Ultra-thin Wafers, Interconnect (Integrated Circuits) +22

Facilitating Ultrathin Wafer Handling for TSV Processing

A. Jouve, Shelly Fowler, Mark Privett et al. · 2008 · 42 citations

Engineering, Mechanical Engineering, Ultrathin Wafer Handling +17

Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Anne Jourdain, Alain Phommahaxay, Greet Verbinnen et al. · 2013 · 23 citations

Engineering, Stacked Ic Technologies, Wafer Scale Processing +19

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Anne Jourdain, Thibault Buisson, Alain Phommahaxay et al. · 2010 · 18 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16