Greet Verbinnen

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

Engineering, Stacked Ic Technologies, Wafer Scale Processing +17

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

A. Vandooren, J. Franco, Bertrand Parvais et al. · 2018 · 24 citations

Engineering, Low Thermal Budget, Top Mosfets +21

Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Anne Jourdain, Alain Phommahaxay, Greet Verbinnen et al. · 2013 · 23 citations

Engineering, Stacked Ic Technologies, Wafer Scale Processing +19

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material

Alain Phommahaxay, Goedele Potoms, Greet Verbinnen et al. · 2016 · 17 citations

Engineering, Mechanical Engineering, Silicon On Insulator +23

3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability

A. Vandooren, J. Franco, Bertrand Parvais et al. · IEEE Transactions on Electron Devices · 2018 · 16 citations