Concepedia

Author

Greet Verbinnen

IMEC

Also Known As

G. Verbinnen, Greet Verbinnen

22

Publications

215

Citations

9

H-Index

29

Concepts

All Affiliations

IMECBrewer Science (United States)SUSS MicroTec (Germany)
GV

About

Greet Verbinnen is an author at IMEC specializing in engineering, applied physics, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

5

5

112

2

Applied Physics

5

5

112

3

Natural Sciences

1

1

17

4

Computer Engineering

1

1

14

5

Electrical Engineering

1

1

24

Greet Verbinnen

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8

Publications

149

Citations

8

H-Index

YearCitations

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen,

2012

34

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

A. Vandooren, J. Franco, Bertrand Parvais,

2018

24

Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Anne Jourdain, Alain Phommahaxay, Greet Verbinnen,

2013

23

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material

Alain Phommahaxay, Goedele Potoms, Greet Verbinnen,

2016

17

3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability

A. Vandooren, J. Franco, Bertrand Parvais,

IEEE Transactions on Electron Devices

2018

16

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

A. Vandooren, Liesbeth Witters, J. Franco,

2018

14

On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes

Celso Cavaco, Lan Peng, Farid Sebaai,

ECS Transactions

2015

11

Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications

Anne Jourdain, Alain Phommahaxay, Greet Verbinnen,

2012 4th Electronic System-Integration Technology Conference

2012

10

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