Anne Jourdain

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Sayanu Pamidighantam et al. · 2003 · 105 citations

Electrical Engineering, Mems Devices, Engineering +12

Design considerations and technology assessment of phased-array antenna systems with RF MEMS for automotive radar applications

Joerg Schoebel, Thomas Bück, Mathias Reimann et al. · IEEE Transactions on Microwave Theory and Techniques · 2005 · 105 citations

Radar, Radar Beams, Engineering +13

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren et al. · 2008 · 86 citations

Engineering, Device Integration, Computer Architecture +16

Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Kris Baert et al. · Journal of Micromechanics and Microengineering · 2005 · 86 citations

Mems Devices, Engineering, Mechanical Engineering +18