Piet De Moor

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 191 citations

Engineering, Materials Engineering, Materials Science +17

Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Sayanu Pamidighantam et al. · 2003 · 105 citations

Engineering, Electrical Engineering, Materials Science +17

<title>Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal</title>

Ann Witvrouw, Bert Du Bois, Piet De Moor et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2000 · 98 citations

Engineering, Materials Engineering, Materials Science +17

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren et al. · 2008 · 86 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Kris Baert et al. · Journal of Micromechanics and Microengineering · 2005 · 86 citations

Engineering, Materials Engineering, Materials Science +16