Bart Swinnen

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 191 citations

Engineering, Materials Engineering, Materials Science +17

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Computer Engineering, Electrical Engineering +17

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz et al. · 2010 · 119 citations

Engineering, Computer Engineering, Electrical Engineering +17

HDAC6 inhibition restores TDP‐43 pathology and axonal transport defects in human motor neurons with TARDBP mutations

Raheem Fazal, Steven Boeynaems, Ann Swijsen et al. · The EMBO Journal · 2021 · 106 citations · Full text

Life Sciences, Neurology, Neuroscience +17

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Petar Ratchev, Serguei Stoukatch, Bart Swinnen · Microelectronics Reliability · 2005 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +12