A. Mercha

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Vertical GAAFETs for the Ultimate CMOS Scaling

Dmitry Yakimets, Geert Eneman, P. Schuddinck et al. · IEEE Transactions on Electron Devices · 2015 · 191 citations

Power Consumption, Electrical Engineering, Engineering +13

Planar Bulk MOSFETs Versus FinFETs: An Analog/RF Perspective

V. Subramanian, Bertrand Parvais, Jonathan Borremans et al. · IEEE Transactions on Electron Devices · 2006 · 150 citations

Device Modeling, Low-power Electronics, Electrical Engineering +10

A 5-GHz fully integrated ESD-protected low-noise amplifier in 90-nm RF CMOS

D. Linten, S. Thijs, M. Natarajan et al. · IEEE Journal of Solid-State Circuits · 2005 · 148 citations

Low-power Electronics, Electrical Engineering, Esd Protection +10

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18