Guruprasad Katti

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

Guruprasad Katti, Michele Stucchi, K. De Meyer et al. · IEEE Transactions on Electron Devices · 2009 · 579 citations

Three-dimensional Ics, Engineering, Silicon Vias +19

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka et al. · Applied Physics Reviews · 2015 · 155 citations

Engineering, Vlsi Design, Device Integration +20

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance

Guruprasad Katti, Michele Stucchi, J. Van Olmen et al. · IEEE Electron Device Letters · 2010 · 86 citations

3D Ic Architecture, Electrical Engineering, Physical Design (Electronics) +15