Michele Stucchi

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

Guruprasad Katti, Michele Stucchi, K. De Meyer et al. · IEEE Transactions on Electron Devices · 2009 · 584 citations

Engineering, Computer Engineering, Electrical Engineering +17

Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies

E. Grossar, Michele Stucchi, Karen Maex et al. · IEEE Journal of Solid-State Circuits · 2006 · 462 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Computer Engineering, Electrical Engineering +17

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 135 citations

Engineering, Materials Engineering, Materials Science +14