Karen Maex - Concepedia

Author

Karen Maex

IMEC

Also Known As

Ch Laurent, David De Roest, E Kondoh, K Maex, K. MAEX, K. Maex, K. maex, KAREN MAEX, Karen Maex, Vandenberghe, S.

754

Publications

12.3K

Citations

H-Index

167

Concepts

All Affiliations

IMEC KU Leuven Philips (Belgium)Texas Instruments (United States)Ghent University

About

Karen Maex is an author at IMEC specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	47	210	10.5K
2	Applied Physics	41	152	8.3K
3	Natural Sciences	12	12	395
4	Education	1	1	18
5	Biomedical Engineering	1	1	13

Karen Maex

221

Publications

10.7K

Citations

H-Index

Page 1

	Year	Citations
Low dielectric constant materials for microelectronics Karen Maex, Mikhaı̈l R. Baklanov, Denis Shamiryan, Journal of Applied Physics DielectricsEngineeringElectrical PerformanceChemical DepositionOn-chip Wiring	2003	1.6K
Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies E. Grossar, Michele Stucchi, Karen Maex, IEEE Journal of Solid-State Circuits Non-volatile MemoryEngineeringMemory DesignMeasurementEmerging Memory Technology	2006	456
Tunnel field-effect transistor without gate-drain overlap Anne S. Verhulst, William G. Vandenberghe, Karen Maex, Applied Physics Letters Device ModelingElectrical EngineeringElectronic DevicesEngineeringHigh-speed Electronics	2007	428
Low-k dielectric materials Denis Shamiryan, Thomas Abell, Francesca Iacopi, Materials Today DielectricsEngineeringVlsi DesignLow-k Dielectric MaterialsComputer Architecture	2004	377
The reasons why metals catalyze the nucleation and growth of carbon nanotubes and other carbon nanomorphologies Santiago Esconjauregui, Caroline M. Whelan, Karen Maex Carbon Materials ScienceCatalytic ApplicationEngineeringCarbon-based MaterialNanomaterials	2008	320
Silicides for integrated circuits: TiSi2 CoSi2 Karen Maex Materials Science and Engineering R Reports EngineeringApplied PhysicsTisi2 Cosi2SiliceneIntegrated Circuits	1993	233
Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions Wen‐Wei Wu, Sywert Brongersma, M. Van Hove, Applied Physics Letters EngineeringElectron DiffractionGrain-boundary ScatteringElectron PhysicResistor	2004	225
Influence of the electron mean free path on the resistivity of thin metal films W. Zhang, Sywert Brongersma, Bert Brijs, Microelectronic Engineering Materials ScienceThin Metal FilmsEngineeringSpecific ResistancePhysics	2004	225
Complementary Silicon-Based Heterostructure Tunnel-FETs With High Tunnel Rates Anne S. Verhulst, William G. Vandenberghe, Karen Maex, IEEE Electron Device Letters Semiconductor TechnologyWide-bandgap SemiconductorElectrical EngineeringHigh Tunnel RatesComplementary Tfets	2008	185
Self-annealing characterization of electroplated copper films Sébastien Lagrange, Sywert Brongersma, Moshe Judelewicz, Microelectronic Engineering Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2000	163

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